Working field:
Research and development for assembly and connection technology with focus on micro-optical systems for optical data communication, medical technology, quantum technology and sensor technology.
The work at TU Berlin focusses on the development
Requirements:
o Experience and knowledge in the field of bonding (e.g. laser bonding, metallic interconnection technology, glueing)
o Experience and knowledge in the field of micro-assembly using pick & place devices
o Design and simulation of optical and opto-electronic components / systems and use of simulation and design tools (Ansys / Lumerical, COMSOL, etc.)
o Test and characterization of optical and opto-electronic components and systems
Desirable would be experience/knowledge:
What you can expect:
How to apply:
Please send your application with the
reference number and the usual documents (one file max. 5 MB)
only via email to
personal@tmp.tu-berlin.de.
By submitting your application via email you consent to having your data electronically processed and saved. Please note that we do not provide a guaranty for the protection of your personal data when submitted as unprotected file. Please find our data protection notice acc. DSGVO (General Data Protection Regulation) at the TU staff department homepage:
https://www.abt2-t.tu-berlin.de/menue/themen_a_z/datenschutzerklaerung/ or quick access 214041.
To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities.
Technische Universität Berlin - Die Präsidentin -Fakultät IV- Elektrotechnik und Informatik, Forschungsschwerpunkt Technologien der Mikroperipherik, Prof. Dr.-Ing. Martin Schneider-Ramelow , Sekr. TIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin