Fraunhofer IZM
The Fraunhofer Institute for Reliability and Microintegration, IZM, is one of the world's leading institutes for electronic packaging and system-integration technologies as well as for applied research and development of robust and reliable electronic components, modules and systems.
Working field:
We are looking for a student to help us improve our thin-film fabrication capabilities. The main focus will be on deposition of metals, polymers and ceramics to be used as interconnects, electrodes or encapsulation for medical devices.
In the group "Technologies for Bioelectronics" at Fraunhofer IZM we design and fabricate active neural interfaces. We integrate small custom-designed electronics into microsystems for stimulation of and recording from the neural tissue. Our microsystems are often flexible implants based on biocompatible materials tailored for the central or peripheral nervous system. We design, fabricate, package and test our implants for long-term use. We also investigate new approaches for neural stimulation and wireless power and data transfer.
Requirements:
Ongoing studies (mandatory) in the fields of electrical engineering, biomedical engineering, materials science, or comparable
Experience of thin film characterization techniques such as microscopy, profilometry or interferometry
Experience of working in a lab
Initiative and a high level of interest in experimental and analytical activities
High proficiency in English
Work on-site
Should your profile not correspond to the requirements to the full extent, do not hesitate to apply. If you bring with you a learn-on-the-job mentality and high motivation support will always be provided when needed.
What we offer:
Exposure to cutting edge research environment
Training on all necessary equipment
Friendly international work environment
Potential for a broader research scope, as projects evolve
Your main tasks will be:
Sputtering of thin metal films on a variety of substrates
Electroplating
Deposition of Parylene C via the Gorham process
Atomic layer deposition of ceramics
Lamination of thermoplastic films
Surface treatment of thin films
Characterization of thin films
Consistent project updates and discussions
Regular report writing
How to apply: